| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer holder plate for polishing a semiconductor wafer that prevents the occurrence of polishing sag on the outer edge of a semiconductor wafer. <P>SOLUTION: A silicon wafer W is bonded to the underside of a carrier plate 14 via a resin wax layer 20. In that case, the center of the wafer is bonded to a flat area a of the carrier plate 14 and the outer edge of the wafer is bonded to a pin structure area b of the carrier plate 14. Thus, the resin wax layer 20 having been applied to the silicon wafer W with an even thickness enters a gap between pins p in the pin structure area b of the carrier plate 14. Hence, the outer edge of the resin wax layer 20 can be reduced in thickness according to an amount of sag appearing on the outer edge of the wafer after polishing caused by elastic deformation of a polishing cloth 13, thereby preventing the occurrence of polishing sag on the outer edge of the wafer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
