| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing device that has a double window structure provided with a window member and a waterproof window and can be improved in the detection accuracy of the polishing ending point of a wafer. <P>SOLUTION: The waterproof window 27 of the wafer polishing device is disposed in a state where the front and rear surfaces 27A and 27B of the window 27 are relatively inclined with respect to a plane 33 containing the optical axis 31A of a projecting-side light guide 30A and the optical axis 31B of a receiving-side light guide 30B so that harmful light rays reflected by the front and rear surfaces 27A and 27B of the window 27 may not be received by the receiving-side light guide 30B. Since the receiving-side light guide 30B only receives the light reflected by the polished surface of the wafer W, the detection accuracy of the polishing ending point of the wafer W is improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
