WIRING BOARD, SEMICONDUCTOR MODULE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To mount a semiconductor chip on a wiring board keeping them aligned with each other. SOLUTION: An insulating layer 3 is patterned so as to form an insulating guide 4 provided with recesses 4a on wiring 2, and a projecting electrode 4 is provided in each of the recesses 4a. The projecting electrodes 4 are restrained from getting out of position when the projecting electrodes 4 are bonded to the interconnecting lines 2. COPYRIGHT: (C)2005,JPO&NCIPI