发明名称 HIGH SPEED CONNECTOR
摘要 A device-under test (DUT) assembly (102) includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly (402) includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies (202). Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly (202).
申请公布号 WO2004079865(A3) 申请公布日期 2005.02.03
申请号 WO2004US05858 申请日期 2004.02.25
申请人 XANDEX INC.;SINSHEIMER, ROGER;WILLIAMS, EVAN, D. 发明人 SINSHEIMER, ROGER;WILLIAMS, EVAN, D.
分类号 G01R31/02;G01R31/28;G01R31/319 主分类号 G01R31/02
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