| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure without lowering connection and reliability of a substrate and a conductive connection pin. <P>SOLUTION: Stress initially generated with a conductive adhesive 86 is dispersed by propagating toward the outside of the conductive connection pin 80 along a ridge line of the upper and lower faces of the joint 84, by lessening an upper face area more than a lower face area of a joint part 84 of the conductive connection pin 80. Thus, the stress does not remain in the conductive connection pin 80, and does not cause inclination, fall-off or the like. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
