发明名称 |
METHOD OF ETCHING HAFNIUM OXIDE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of etching hafnium oxide by which the hafnium oxide formed on a substrate can be etched satisfactorily. SOLUTION: In the method of etching hafnium oxide, an etchant composed of a mixed solution of a hydrofluoric acid and a concentrated sulfuric acid is supplied to a substrate W held by a spin chuck 1 from an etchant supplying nozzle 11 (an etching step with hydrofluoric acid). Then the etchant is washed away from the surface of the substrate W by supplying a pre-rinsing solution composed of a concentrated sulfuric acid or concentrated acetic acid to the substrate W from a pre-rinsing solution supply nozzle 12 (pre-rinsing step). Thereafter, the pre-rinsing solution is washed away from the substrate W by supplying pure water to the substrate W from a pure water supply nozzle 13 (rinsing step with pure water). Since the hydrofluoric acid is washed away from the substrate W in a state where no water exists on the substrate W and thereafter the rinsing is performed with the pure water, the constituent material of the substrate W is not etched undesirably by the hydrofluoric acid. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005032914(A) |
申请公布日期 |
2005.02.03 |
申请号 |
JP20030195009 |
申请日期 |
2003.07.10 |
申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
OKAMOTO TADAO;WADA TAKUYA |
分类号 |
H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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