METHOD OF FORMING MULTILAYER WIRING, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a very simple method of forming multilayer wiring by which the utilization efficiency of materials can be increased and the manufacturing cost of multilayer wiring can be reduced by reducing the number of processes. SOLUTION: The method of forming multilayer wiring, in which first and second conductive layers 14 and 16 are laminated upon another through an insulating layer 26 and connected to each other through a through hole 28 formed in the insulating layer 26, includes a step of forming the first conductive layer 14 on a substrate 10, a step of forming the insulating layer 26 having the through hole 28 on the conductive layer 14, and a step of forming a contacting conductive member 15 by packing a conductive material in the through hole 28 by using a droplet discharging device. The method also includes a step of forming the second conductive layer 16 in a state where the layer 16 is connected to the conductive member 15. COPYRIGHT: (C)2005,JPO&NCIPI