发明名称 LAYERED BODY FOR THIN FILM DEPOSITION USED FOR METAL THIN FILM DEPOSITION SYSTEM, AND METAL THIN FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a layered body for thin film deposition with which, even in the case dimensional deformation (plastic deformation) is generated in a cooling plate, a bolt hole and a water feed-discharge port through which cooling water is made to flow provided in a support member and an opening hole provided in the cooling board can be communicated in a normal arrangement state. SOLUTION: The layered body 20 for thin film deposition is composed in a state wherein a target material 21 and a cooling board 23 are layered. The cooling board 23 is composed of a stock having a rigidity lower than that of the target 21 and a thermal expansion coefficient different from that of the same. Then, bolt holes 231 on the side of the cooling board are formed of a shape elongating from the central position of each bolt hole 231 to the central position C in positioning and to the direction IH opposite thereto. Water feed-discharge ports 241 on the side of the cooling board are arranged in a state where the central position is deviated to a direction almost opposite to the direction WH going from the central position of the water feed-discharge port 15 on the side of the system to the central position C in positioning. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005029850(A) 申请公布日期 2005.02.03
申请号 JP20030271749 申请日期 2003.07.08
申请人 KOBELCO KAKEN:KK 发明人 YOSHIKAWA KAZUO;SHIGEYAMA KAZUKI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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