发明名称 Device for liquid treatment of wafer-shaped articles
摘要 A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary forces.
申请公布号 US2005026448(A1) 申请公布日期 2005.02.03
申请号 US20040929568 申请日期 2004.08.31
申请人 发明人 ENGESSER PHILIPP
分类号 H01L21/683;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):C23G1/00;H01L21/302;H01L21/461 主分类号 H01L21/683
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