| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in adhesive strength to polyimide without applying surface treatment, etc., and useful in an electric material field. SOLUTION: The adhesive composition for polyimide comprises (a) a phenolic hydroxy group-containing polyamide, preferably a wholly aromatic polyamide having a recurring structure represented by formula (A) (wherein R<SB>1</SB>and R<SB>2</SB>are each a divalent aromatic group and may mutually be same or different; n is an average substituent group number and represent a 1-4 positive number; x, y and z are each an average polymerization degree and x, y and z are respectively positive numbers of 1-10, 0-20 and 1-50) and (b) an aromatic epoxy resin. COPYRIGHT: (C)2005,JPO&NCIPI |
