| 摘要 |
PROBLEM TO BE SOLVED: To provide a formation method of a wiring pattern of a printed wiring board and a manufacturing method of the printed wiring board capable of reducing a material cost for resist pattern formation in a resist pattern formation process of forming a resist pattern on the copper foil of a copper clad laminate and manufacturing an inexpensive and high-quality printed wiring board. SOLUTION: A double-sided copper clad laminate 10 is roughened, a photosetting resin solution is jetted from the ink-jet nozzle of an ink-jet printer by using the ink-jet printer, and the resist patterns 31a and 31b are formed on the copper foil 21 of the double-sided copper clad laminate 10. Then, the ends of the resist patterns 31a and 31b are laser-worked with a laser beam, molding resist patterns 31a' and 31b' are formed, the copper foil 21 is etched, and a double-sided printed wiring board 20 for which the wiring patterns 21a and 21b are formed on both surfaces of an insulating base material 11 is obtained. COPYRIGHT: (C)2005,JPO&NCIPI |
