| 摘要 |
PROBLEM TO BE SOLVED: To protect an active element region from an external environment (e.g., a light or an electric noise) by a conductive layer, and to enhance reliability. SOLUTION: A method for manufacturing a semiconductor device contains forming a plurality of through electrodes 54 which penetrate through first and second planes 20, 21 of a semiconductor substrate having an active element region 12, and a conductive layer 38 electrically connected to at least one of the plurality of through electrodes 54. The conductive layer 38 is formed so as to overlap the whole active element region in the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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