发明名称 CERAMIC WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive ceramic wiring board which can reduce the mounting area, the thermal stress, and can be visually checked, and to provide its manufacturing method. SOLUTION: The ceramic wiring board 10 is equipped with a plurality of external connection terminals 11 of conductive metal which are formed together with a ceramic sheet by baking on its one main surface and surface-mounted on a mounting board 13 using the external connection terminals 11. An undercut is provided on the main surface of the ceramic wiring board 10 to produce a level difference 15 receding inward from the peripheral edge of the one main surface of the wiring board 10, and the side 16 of the level difference 15 is coated with conductor metal to serve as the external connection terminal 11. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032787(A) 申请公布日期 2005.02.03
申请号 JP20030193334 申请日期 2003.07.08
申请人 MURATA MFG CO LTD 发明人 YAMAMOTO TOSHISHIGE
分类号 H05K1/14;H01L23/12;(IPC1-7):H01L23/12 主分类号 H05K1/14
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