发明名称 PUMP FOR SOLDERING TANK AND SOLDERING TANK USING THE SAME
摘要 PROBLEM TO BE SOLVED: To make better the efficiency of feeding solder, to eliminate the waves of solder flowing out from a nozzle, and to prevent the intrusion of oxidized dross into the solder. SOLUTION: In the pump for a soldering tank, the penetrating internal space 13 of a casing 12 is rotatably provided with a screw 14 where a plurality of helical blades 21 are projected out at equal intervals in the circumferential direction to the outside of a rotary shaft 20, and also, all the periphery of the rotary shaft is surrounded with all the helical blades when viewed from the shaft line direction. In the soldering tank, a solder feeding chamber 2 is formed inside the tank 1, the solder feeding chamber is provided with an inlet 3 at the side lower than a liquid face level L, further, an outlet 4 is provided at the side upper than the liquid face level L, the pump 5 for the soldering tank described in the claim 1 is attached to the inlet, and solder is fed along the penetrating direction of the casing. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005028446(A) 申请公布日期 2005.02.03
申请号 JP20030352160 申请日期 2003.10.10
申请人 KTT:KK 发明人 TAKAGUCHI AKIRA;SATOU ITSUSAKU;HASHIMOTO NOBORU;OKAMURA JUNICHI
分类号 B23K3/06;B23K1/08;(IPC1-7):B23K3/06 主分类号 B23K3/06
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