| 发明名称 |
MEMS having a three-wafer structure |
| 摘要 |
A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.
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| 申请公布号 |
US2005023547(A1) |
申请公布日期 |
2005.02.03 |
| 申请号 |
US20030630769 |
申请日期 |
2003.07.31 |
| 申请人 |
HARTWELL PETER G.;HOEN STORRS T.;HORSLEY DAVID;YANG CHUNG CHING;MERCHANT PAUL P.;TAUSSIG CARL P.;O'NEILL-MERCHANT GAIL |
发明人 |
HARTWELL PETER G.;HOEN STORRS T.;HORSLEY DAVID;YANG CHUNG CHING;MERCHANT PAUL P.;TAUSSIG CARL P.;O'NEILL-MERCHANT GAIL |
| 分类号 |
G01P15/125;B81B3/00;B81B5/00;B81B7/00;B81B7/02;H01L29/82;H01L33/00;(IPC1-7):H01L33/00 |
主分类号 |
G01P15/125 |
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