发明名称 Apparatus for bonding substrates and method for bonding substrates
摘要 Includes a lower holding table on which one substrate is held with the inner surface up and the outer surface down, an upper holding table provided above and opposed to the lower holding table, the bottom surface of which is used as a holding surface that holds the other substrate, a supplying device that holds the other substrate with the outer surface up and supplies the other substrate to a position at which the outer surface of the other substrate faces the holding surface of the upper holding table, a delivering device that delivers the other substrate that has been supplied to the position opposing the holding surface of the upper holding table by the supplying device, onto the holding surface of the upper holding table such that the outer surface of the other substrate is held, and a driving device that drives the upper and lower holding tables relatively in vertical and horizontal directions to align the two substrates held on the holding tables and bond them together via a sealing agent.
申请公布号 US2005022938(A1) 申请公布日期 2005.02.03
申请号 US20030742540 申请日期 2003.12.19
申请人 SHIBAURA MECHATRONICS CORPORATION 发明人 MASUDA HIROKAZU
分类号 G02F1/13;B23H5/08;B32B38/18;G02F1/1333;(IPC1-7):B32B31/00;B30B1/00;B23K37/00 主分类号 G02F1/13
代理机构 代理人
主权项
地址