| 摘要 |
PROBLEM TO BE SOLVED: To obtain a stable adhesive film for a multilayer printed circuit board, excellent in formability, and especially providing, a little bleeding amount of a resin to a cavity part in a heating and pressurizing step when laminating. SOLUTION: This adhesive film 1 used for a multilayer printed circuit board formed by laminating at least two or more substrates to form a multilayer has the minimum viscosity within the range of 3×10<4> -1×10<5> Pa.s when the heating and laminating press is carried out. When the heating rate at the heating and laminating press is 5-10 deg.C/min and the retaining temperature is 170-180 deg.C, the minimum viscosity is within the range of 3×10<4> -1×10<5> Pa.s. The viscosity characteristics is obtained by using the adhesive film for the multilayer printed circuit board consisting essentially of an acrylic rubber containing an epoxy group, which is a specific copolymer. |
