发明名称 Substrate processing apparatus
摘要 A first processing unit group for performing solution processing and a second processing unit group including heat and cooling processing units each having a heat processing unit and a cooling processing unit are arranged adjacent to each other such that the cooling processing unit is located on the first processing unit group side. This makes it possible to conduct temperature control precisely in a solution processing unit for performing solution processing for a substrate at about room temperature. <IMAGE>
申请公布号 EP1091390(A3) 申请公布日期 2005.02.02
申请号 EP20000308842 申请日期 2000.10.06
申请人 TOKYO ELECTRON LIMITED 发明人 UEDA, ISSEI;OKUMURA, KENJI;TAKEKUMA, TAKASHI
分类号 H01L21/027;H01L21/00 主分类号 H01L21/027
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