RETAINER-RING STRUCTURE WITH GROOVES USED IN CHEMICAL MECHANICAL POLISHING EQUIPMENT

摘要

PURPOSE: A retainer-ring structure used in a CMP(Chemical Mechanical Polishing) equipment is provided to improve transmission capability of a slurry and holding capability by forming a plurality of grooves at the retainer-ring. CONSTITUTION: A retainer-ring(33) used in a CMP equipment is located to surround a wafer(31). The wafer is loaded on a polishing pad. The retainer-ring is provided with a plurality of grooves(33a) spaced apart from each other according to longitudinal direction of the retainer-ring. The width of the retainer-ring is 1.5-3cm. The depth of the retainer-ring is 1-2 mm.