发明名称 LUMINESCENT DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME OBTAINABLE HIGH BRIGHTNESS BY PACKAGING MULTIPLE LED
摘要 PURPOSE: A luminescent diode package and a method for manufacturing the same are provided to obtain the high brightness by packaging a multitude of high-output LEDs(light emitting diodes). CONSTITUTION: A luminescent diode package includes a wiring part, a multitude of LEDs, a reflecting cup portion and a lens portion. The wiring part(320) controls the power and input-output signals incoming to/outgoing from LEDs. The multitude of LEDs(301a,301c) are packaged on the wiring part. The reflecting cup portion(311) joined to the wiring part radiates light generated from the LEDs. The lens portion(330) formed on the reflecting cup portion radiates light generated from the LEDs to outside.
申请公布号 KR20050012372(A) 申请公布日期 2005.02.02
申请号 KR20030051315 申请日期 2003.07.25
申请人 LG INNOTEC CO., LTD. 发明人 PARK, JUN SEOK
分类号 H01L33/58;H01L33/60;(IPC1-7):H01L33/00 主分类号 H01L33/58
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