A process of producing a semiconductor device

摘要

A semiconductor device having a semiconductor element, characterized in that said semiconductor device comprises a stacked body obtained by providing a laminate comprising said semiconductor element and a sealing resin which are interposed between a surface member and a back face member, vacuuming said laminate at a vacuum degree of 5 Torr or less for 5 to 40 minutes, subjecting the laminate thus treated to thermocompression bonding at a vacuum degree of 5 Torr or less, and cooling the laminate having subjected to said thermocompression bonding to engage in contact bonding. And a process for the production of a semiconductor device. The semiconductor device is free of the generation of air bubble therein.