SEMICONDUCTOR PACKAGE AND PACKAGE MODULE STACKING THE SAME FOR REDUCING LARGELY THICKNESS OF WIRE

摘要

PURPOSE: A semiconductor package and a package module stacking the same are provided to reduce largely a thickness of a wire by using a structure having a conductive film as the wire. CONSTITUTION: A semiconductor chip(20) includes a plurality of bonding pads and first bumps formed on the bonding pads. The semiconductor chip is mounted on an upper surface of a substrate(30). A plurality of second bumps corresponding the first bumps are formed on an edge of the substrate. A film(40) is formed on the semiconductor chip and the substrate in order to connect the first bump to the second bump. The bonding pads are formed in a predetermined interval on an edge part of the semiconductor chip.