CMP APPARATUS FOR SUPPORTING AND POLISHING SIMULTANEOUSLY TWO OR MORE WAFERS BY USING TWO OR MORE POLISHING HEADS

摘要

PURPOSE: A CMP apparatus is provided to support and polish simultaneously two or more wafers by installing two or more polishing heads at each of polishing head parts. CONSTITUTION: A plurality of rotary surface plates(15a-15c) are rotated to one direction. A plurality of polishing head parts(19a-19d) are installed on a rotary shaft opposite to the rotary surface plates in order to support polishing wafers. Two or more polishing heads are installed at each of the polishing heads. The polishing pads are used for supporting and polishing a plurality of wafers in a polishing process. A diameter of the wafer is 8 inches and a diameter of the rotary surface plate is 22.5 inches.