发明名称 |
Electroplating reactor including back-side electrical contact apparatus |
摘要 |
An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.
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申请公布号 |
US6849167(B2) |
申请公布日期 |
2005.02.01 |
申请号 |
US20030338200 |
申请日期 |
2003.01.07 |
申请人 |
SEMITOOL, INC. |
发明人 |
WOODRUFF DANIEL J.;HANSON KYLE M.;BATZ, JR. ROBERT W.;KUECHMANN JAMES T. |
分类号 |
C25D7/12;H01L21/687;(IPC1-7):C25B9/12;C25D17/06 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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