发明名称 Method of fabricating a multilayer dielectric tunnel barrier structure
摘要 A multilayer dielectric tunnel barrier structure and a method for its formation which may be used in non-volatile magnetic memory elements comprises an ALD deposited first nitride junction layer formed from one or more nitride monolayers i.e., AlN, an ALD deposited intermediate oxide junction layer formed from one or more oxide monolayers i.e., AlxOy, disposed on the first nitride junction layer, and an ALD deposited second nitride junction layer formed from one or more nitride monolayers i.e., AlN, disposed on top of the intermediate oxide junction layer. The multilayer tunnel barrier structure is formed by using atomic layer deposition techniques to provide improved tunneling characteristics while also providing anatomically smooth barrier interfaces.
申请公布号 US6849464(B2) 申请公布日期 2005.02.01
申请号 US20020165301 申请日期 2002.06.10
申请人 MICRON TECHNOLOGY, INC. 发明人 DREWES JOEL A.
分类号 C23C16/30;C23C16/40;C23C16/44;C23C16/455;H01F10/32;H01F41/22;H01F41/32;H01L21/316;H01L43/12;(IPC1-7):H11L21/00 主分类号 C23C16/30
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