发明名称 |
Apparatus and process for polishing a workpiece |
摘要 |
A process for removing a metallized surface from a workpiece is provided. A kinetic removal mechanism for removal of the metallized surface is characterized by a formation step for formation of a removable surface film and an abrasive step for removal of the film. The process includes causing the workpiece to contact a polishing surface while effecting relative motion between the workpiece and the polishing surface. The process also includes causing a polishing solution having less than 1 wt % of a polishing abrasive to be distributed at a contact area between the workpiece and the polishing surface so that the abrasive step is a rate-determining step of the removal mechanism.
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申请公布号 |
US6849547(B2) |
申请公布日期 |
2005.02.01 |
申请号 |
US20010826674 |
申请日期 |
2001.04.05 |
申请人 |
SPEEDFAM IPEC CORPORATION |
发明人 |
CHADDA SAKET;EMESH ISMAIL;MUELLER BRIAN L. |
分类号 |
B24B57/02;H01L21/321;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B57/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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