发明名称 Beam processing apparatus
摘要 A beam processing apparatus comprises a workpiece holder (20) for holding a workpiece (X), a plasma generator for generating a plasma in a vacuum chamber (3), first electrode (4) disposed in the vacuum chamber (3), and a second electrode (5) disposed upstream of the first electrode (4) in the vacuum chamber (3). The beam processing apparatus further comprises a voltage applying unit for applying a variable voltage between the first electrode (4) and the second electrode (5) to alternately extract positive ions (6) and negative ions from the plasma generated by the plasma generator.
申请公布号 US6849857(B2) 申请公布日期 2005.02.01
申请号 US20030471610 申请日期 2003.09.24
申请人 EBARA CORPORATION 发明人 ICHIKI KATSUNORI;YAMAUCHI KAZUO;HIYAMA HIROKUNI;SAMUKAWA SEIJI
分类号 H05H1/46;B01J19/08;C23C14/32;H01J37/08;H01J37/30;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H01J37/00 主分类号 H05H1/46
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