发明名称 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
摘要 An electrically continuous conformal EMI protective shield for conformingly adhering directly to surfaces of a printed circuit board is disclosed. The EMI protective shield comprises a dielectric coating and a conductive coating. The dielectric coating adheres directly to surfaces of the printed circuit board to provide an electrically nonconductive, contiguous coating that covers all such printed circuit board surfaces. The conductive coating comprises a substantially contiguous layer of an intrinsically conducting polymer adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents the passage of electromagnetic emissions through the conformal EMI shield.
申请公布号 US6849800(B2) 申请公布日期 2005.02.01
申请号 US20030628175 申请日期 2003.07.28
申请人 发明人
分类号 H01L23/552;H05K1/02;H05K3/28;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01L23/552
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