发明名称 |
METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF PRODUCING A MULTI-CHIP MODULE THAT INCLUDES PATTERNING WITH A PHOTOMASK THAT USES METAL FOR BLOCKING EXPOSURE LIGHT AND A PHOTOMASK THAT USES ORGANIC RESIN FOR BLOCKING EXPOSURE LIGHT |
摘要 |
Productivity of a semiconductor integrated circuit device is improved. According to how many times the photomask is used, a photomask having an opaque pattern made of metal and a photomask having an opaque pattern made of a resist film are properly used, and thereby an exposure treatment is performed.
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申请公布号 |
US6849540(B2) |
申请公布日期 |
2005.02.01 |
申请号 |
US20020296495 |
申请日期 |
2002.11.25 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
TERASAWA TSUNEO;TANAKA TOSHIHIKO;MIYAZAKI KO;HASEGAWA NORIO;MORI KAZUTAKA |
分类号 |
G03F1/08;G03F1/10;G03F1/14;G03F1/54;G03F1/56;G03F7/20;H01L21/768;(IPC1-7):H01L21/027 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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