发明名称 METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF PRODUCING A MULTI-CHIP MODULE THAT INCLUDES PATTERNING WITH A PHOTOMASK THAT USES METAL FOR BLOCKING EXPOSURE LIGHT AND A PHOTOMASK THAT USES ORGANIC RESIN FOR BLOCKING EXPOSURE LIGHT
摘要 Productivity of a semiconductor integrated circuit device is improved. According to how many times the photomask is used, a photomask having an opaque pattern made of metal and a photomask having an opaque pattern made of a resist film are properly used, and thereby an exposure treatment is performed.
申请公布号 US6849540(B2) 申请公布日期 2005.02.01
申请号 US20020296495 申请日期 2002.11.25
申请人 RENESAS TECHNOLOGY CORP. 发明人 TERASAWA TSUNEO;TANAKA TOSHIHIKO;MIYAZAKI KO;HASEGAWA NORIO;MORI KAZUTAKA
分类号 G03F1/08;G03F1/10;G03F1/14;G03F1/54;G03F1/56;G03F7/20;H01L21/768;(IPC1-7):H01L21/027 主分类号 G03F1/08
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