发明名称 BASIC MATERIAL FOR PCB REINFORCED USING REINFORCEMENT MATERIAL AND MANUFACTURING METHOD OF PCB USING THE SAME
摘要 PURPOSE: A basic material for a PCB(Printed Circuit Board) and a manufacturing method of a PCB using the same are provided to increase a manufacturing yield by minimizing a damage of the basic material by reinforcing the basic material using a reinforcement material. CONSTITUTION: A basic material for a PCB includes a reinforcement material(35) formed around an edge portion of the basic material(30). A metallic layer(33) is formed on a surface of an insulating layer(31) in the basic material. The reinforcement material is made of a refractory material or an anti-plating material. The reinforcement material is a polyimide. The reinforcement material has a tape shape made of a refractory material or an anti-plating material.
申请公布号 KR20050012080(A) 申请公布日期 2005.01.31
申请号 KR20030051173 申请日期 2003.07.24
申请人 LG ELECTRONICS INC. 发明人 LEE, KWANG TAE;LEE, SUNG GUE;MYUNG, BOK SIK;NAME, SANG HYUK;YOUN, SUNG HO
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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