发明名称 |
BASIC MATERIAL FOR PCB REINFORCED USING REINFORCEMENT MATERIAL AND MANUFACTURING METHOD OF PCB USING THE SAME |
摘要 |
PURPOSE: A basic material for a PCB(Printed Circuit Board) and a manufacturing method of a PCB using the same are provided to increase a manufacturing yield by minimizing a damage of the basic material by reinforcing the basic material using a reinforcement material. CONSTITUTION: A basic material for a PCB includes a reinforcement material(35) formed around an edge portion of the basic material(30). A metallic layer(33) is formed on a surface of an insulating layer(31) in the basic material. The reinforcement material is made of a refractory material or an anti-plating material. The reinforcement material is a polyimide. The reinforcement material has a tape shape made of a refractory material or an anti-plating material.
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申请公布号 |
KR20050012080(A) |
申请公布日期 |
2005.01.31 |
申请号 |
KR20030051173 |
申请日期 |
2003.07.24 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, KWANG TAE;LEE, SUNG GUE;MYUNG, BOK SIK;NAME, SANG HYUK;YOUN, SUNG HO |
分类号 |
H05K1/02;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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地址 |
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