| 摘要 |
PURPOSE: A micro type of surface mount coil device is provided to reduce a spread speed of molten solder on a circuit board by separating the circuit board into smaller regions with a notch. CONSTITUTION: A micro type of surface mount coil device includes a coil device body, a lead frame(12), and a molten solder spread preventer. The coil device body includes a drum-shaped core having a coil core, where a coil wire is wound, and flange portions(13,14) provided at both ends of the coil core. The lead frame includes a flange mounting plate and a conductive connecting terminal. The lead frame is held by one flange portion. The flange portion mounting plate is formed of a flat plate material. An outer surface of the flange portion mounting plate is divided into a first region and a second region which are not connected to the conductive portion. The molten solder spread preventer, having any one of a notch, a through hole, and a groove, is provided at least at a portion of a boundary portion between the two regions.
|
