发明名称 |
METHOD FOR MANUFACTURING SOI TRANSISTOR HAVING VERTICAL DOUBLE CHANNELS AND STRUCTURE THEREOF CAPABLE OF INCREASING CURRENT FLOWING THROUGH THE DOUBLE CHANNEL WITHOUT USING COMPLICATED SOI SUBSTRATE FORMATION |
摘要 |
PURPOSE: A method for manufacturing an SOI(Silicon On Insulator) transistor having vertical double channels and a structure thereof are provided to increase current flowing through the double channel without using a complicated SOI substrate formmation by forming the SOI transistor on a bulk semiconductor substrate. CONSTITUTION: A structure of an SOI transistor includes an active region, a gate insulating film, a gate electrode(118), and source and drain regions(121a). The active region is defined by a device isolation film(112) on a substrate(110) and includes a recess. The gate insulating film is formed on a portion of sidewalls of the recess and a portion of a bottom of the recess. The gate electrode is coupled with the sidewalls in a first direction via the gate isolation film and is formed on the recess to be spaced with a predetermined distance from the sidewalls in a second direction perpendicular to the first direction. The source and drain regions are formed on the sidewalls of the first direction with the gate electrode disposed therebetween. |
申请公布号 |
KR20050011881(A) |
申请公布日期 |
2005.01.31 |
申请号 |
KR20030050938 |
申请日期 |
2003.07.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JI YOUNG;PARK, JIN JUN |
分类号 |
H01L21/762;H01L21/336;H01L21/76;H01L21/8234;H01L27/088;H01L27/11;H01L29/423;H01L29/76;H01L29/78;H01L29/786;(IPC1-7):H01L27/11 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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