发明名称 METHOD FOR MANUFACTURING SOI TRANSISTOR HAVING VERTICAL DOUBLE CHANNELS AND STRUCTURE THEREOF CAPABLE OF INCREASING CURRENT FLOWING THROUGH THE DOUBLE CHANNEL WITHOUT USING COMPLICATED SOI SUBSTRATE FORMATION
摘要 PURPOSE: A method for manufacturing an SOI(Silicon On Insulator) transistor having vertical double channels and a structure thereof are provided to increase current flowing through the double channel without using a complicated SOI substrate formmation by forming the SOI transistor on a bulk semiconductor substrate. CONSTITUTION: A structure of an SOI transistor includes an active region, a gate insulating film, a gate electrode(118), and source and drain regions(121a). The active region is defined by a device isolation film(112) on a substrate(110) and includes a recess. The gate insulating film is formed on a portion of sidewalls of the recess and a portion of a bottom of the recess. The gate electrode is coupled with the sidewalls in a first direction via the gate isolation film and is formed on the recess to be spaced with a predetermined distance from the sidewalls in a second direction perpendicular to the first direction. The source and drain regions are formed on the sidewalls of the first direction with the gate electrode disposed therebetween.
申请公布号 KR20050011881(A) 申请公布日期 2005.01.31
申请号 KR20030050938 申请日期 2003.07.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JI YOUNG;PARK, JIN JUN
分类号 H01L21/762;H01L21/336;H01L21/76;H01L21/8234;H01L27/088;H01L27/11;H01L29/423;H01L29/76;H01L29/78;H01L29/786;(IPC1-7):H01L27/11 主分类号 H01L21/762
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