ELECTROLYTIC POLISHING COMBINED ELECTROPLATING APPARATUS, CAPABLE OF INCREASING ADHESIVE FORCE OF PLATING LAYER TO PLATING OBJECT BY SUPPRESSING FORMATION OF PIN HOLES BETWEEN PLATING LAYER AND PLATING OBJECT, AND ELECTROLESS PLATING APPARATUS USING THE SAME

摘要

PURPOSE: To provide an electrolytic polishing combined electroplating apparatus for forming a plating film on a plating object formed in a pipe shape and formed of a material selected from the group consisting of precious stone, stainless steel and molybdenum steel, and an electroless plating apparatus using the electrolytic polishing combined electroplating apparatus. CONSTITUTION: The plating system comprising an electrolytic polishing combined electroplating apparatus(10) comprising a transfer means(13) for transferring plating materials(14,15) along a passage in a pipe shaped plating object(16) dipped into an electrolyte(12), and a plating object transfer unit(18) capable of transferring the plating object by impressing a positive voltage to the plating materials connected to the transfer means and impressing a negative voltage to the plating object, or impressing a negative voltage to the plating materials and impressing a positive voltage to the plating object; and an electroless plating apparatus comprising a plating object transfer means which holds the plating object such that the plating object is perpendicular to the horizontal surface of the electrolyte or inclined to the horizontal surface of the electrolyte in a certain angle as an electroless plating apparatus for forming at least one layer of electroless plating film on the surface of the plating object electrolytic polished and/or electroplated by the electrolytic polishing combined electroplating apparatus.