APPARATUS AND METHOD OF TRANSFERRING WAFER WITHOUT DAMAGE

摘要

PURPOSE: An apparatus and method of transferring a wafer are provided to prevent the damage of the wafer by using a transfer pad with an impact absorbing part. CONSTITUTION: A wafer transfer apparatus includes a chuck(18), a grind stone(17) and an impact absorbing part(19) between the chuck and the grind stone. The impact absorbing part is made of an elastic material. A stepped portion(23) exists between the grind stone and the chuck as much as the same height as that of the impact absorbing part. Owing to the stepped portion, the grind stone alone contact a surface of a wafer.