发明名称 |
SUBSTRATE TRANSFER METHOD FOR IMPROVING THROUGHPUT USING TWO DISCRETE TRANSFER LINES OF BAY |
摘要 |
PURPOSE: A substrate transfer method is provided to improve throughput by processing each wafer according to a corresponding state using two discrete transfer lines within a bay. CONSTITUTION: First wafers are transferred one by one from an FOUP(Front Opening Unified Pod) to a bay(100,200,300) by using a first transfer line(121,221,321) of the bay. Second wafers are transferred one by one from the FOUP to the bay by using a second transfer line(122,222,322) of the bay. A plurality of processing units are installed along the first and second transfer lines. The wafers are capable of being transferred between the first and second transfer lines, so that each wafer is processed according to the corresponding state.
|
申请公布号 |
KR20050010998(A) |
申请公布日期 |
2005.01.28 |
申请号 |
KR20050001992 |
申请日期 |
2005.01.10 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORPORATION |
发明人 |
EGAWA, YUKO;KAJI, TETSUNORI;UCHIMAKI, YOICHI |
分类号 |
B65G1/00;B65G49/07;H01L21/00;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
B65G1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|