发明名称 |
PROCEDE DE FABRICATION D'UN SUBSTRAT COMPOSITE DU TYPE SICOI COMPRENANT UNE ETAPE D'EPITAXIE |
摘要 |
<p>Fabrication of a composite SiCOI substrate comprises the provision of an initial substrate incorporating a support (1) of Si or SiC supporting a layer (2) of SiO2 carrying a thin film (3) of SiC and the epitaxy of SiC (4) on the thin film of SiC. The epitaxy is realised at the following temperatures: (a) from 1450 degrees C to obtain an epitaxy of polytype 6H or 4H on a carried thin film of polytype 6H or 4H respectively, if the support is of SiC; (b) from 1350 degrees C to obtain an epitaxy of polytype 3C on a carried thin layer of polytype 3C, if the support is of Si or SiC; (c) from 1350 degrees C to obtain an epitaxy of polytype 6H or 4H on a carried thin film of polytype 6H or 4H respectively, if the support is of Si. An Independent claim is also included for a semiconductor device produced on a composite SiCOI substrate obtained.</p> |
申请公布号 |
FR2844095(B1) |
申请公布日期 |
2005.01.28 |
申请号 |
FR20020010884 |
申请日期 |
2002.09.03 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
TEMPLIER FRANCOIS;DI CIOCCIO LEA;BILLON THIERRY;LETERTRE FABRICE |
分类号 |
H01L29/872;C30B25/02;C30B29/36;H01L21/02;H01L21/20;H01L21/205;H01L21/336;H01L21/338;H01L21/76;H01L27/12;H01L29/47;H01L29/786;H01L29/812;H01L29/861;(IPC1-7):H01L21/20;H01L21/762;H01L29/06 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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地址 |
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