METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR IMPROVING THROUGHPUT OF EQUIPMENT

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to improve throughput of a bit of equipment by reducing the time required to load a new wafer into a process chamber from the unloaded point of a process-performed wafer using two modes according to situations. CONSTITUTION: A process chamber is provided(S10). A first transfer chamber and a first loadlock chamber are provided(S20). A second transfer chamber and a second loadlock chamber are provided(S30). First and second cassettes are provided to the first and second loadlock chambers, respectively(S40). Whether the second cassette includes wafers is checked(S50). When the wafers exist in the second cassette, a first mode is used for the following process. When even one wafer is free from the second cassette, a second mode is used for the following process(S60).