| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type electronic component housing mount which can be used favorably with little variation in thickness without causing any defective traveling, even if the housing mount is used after a storage in a sever environmental condition, particularly in a high temperature and high humidity condition, in a paper chip-type electronic component housing mount. SOLUTION: In the paper chip-type electronic component housing mount, a cross-sectional water-absorption is 300 g/m<SP>2</SP>or less, and in addition, a sizing agent added internally has a content of 0.5 to 1.0 mass% relative to pulp. COPYRIGHT: (C)2005,JPO&NCIPI
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