GRINDER AND GRINDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a grinder and a grinding method which automatically stabilizes or varies a relative positional relation between a ground object and a grinding tool in real time, and immediately detects abnormal grinding in real time, without trusting engineer's intuition or experience. SOLUTION: The grinder 1 comprises a turn table 10 for holding and rotating a semiconductor wafer (ground object) W and a grinding tool 40 to which a grinding wheel 45 is attached and that rotates and drives. The grinder 1 grinds the ground surface of the semiconductor wafer W into a flat surface by relatively moving the semiconductor wafer W and the grinding tool 40 while the grinding wheel 45 of the grinding tool 40 is pressed onto the semiconductor wafer W held by the turn table 10. Aside from a bearing (air spindle) 49 for pivoting a driving shaft 47 for rotating the grinding tool 40, a magnetic bearing 60 for controlling the attitude of the grinding tool 40 is installed near the grinding tool 40. COPYRIGHT: (C)2005,JPO&NCIPI