| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device packaging assembly which can operate in a wide range of speed. <P>SOLUTION: The electronic device packaging assembly(10) includes a ball grid array and a specific configuration such that it can operate from a DC up to 50 GHz with minimal parasitic loss. The packaging assembly (10) includes a thin base plate (14). Power vias (48), signal vias (26), and ground vias (46) are formed through the base plate (14) and connected to traces, circuit components, and/or a device (12). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array includes a plurality of solder balls electrically connected to the appropriate vias extending through the base plate (14). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
