| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board mounting structure improved in signal reliability without degrading the facility of high-density connection by reducing reflection that occurs during the transmission of high-frequency signals between a semiconductor device and a circuit board or between circuit boards. <P>SOLUTION: In this circuit board mounting structure, a plurality of pads provided at least on one surface of a first circuit board 1 and a plurality of pads 3b and their leads 5 provided on the surface of a second circuit board 2 facing the surface of the circuit board 1, with the second circuit board 2 having ground planes 8 in its inner layer, are connected to each other by conductive bumps 6. Ground planes 8 in the second circuit board 2 at positions to face the signal pads 3b are excluded, and ground planes 8 adjacent to the signal pads 3b have similar shape to their corresponding pads 3b. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
