| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition that has a high polishing speed and is capable of reducing the waviness of a substrate to be polished, to provide a method for reducing the waviness of the substrate to be polished using the polishing liquid composition and to provide a process for producing a high-quality substrate with reduced waviness using the polishing liquid composition. <P>SOLUTION: The polishing liquid composition comprisesα-alumina, an intermediate alumina, an oxidizing agent and water. The method for reducing the waviness of the substrate to be polished uses the polishing composition. The process for producing the substrate has a step of polishing the substrate to be polished using the polishing liquid composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
