| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with high quality low melting point metal balls, which can be mounted on a substrate by flip-chip bonding, and the method for flip-chip bonding thereof. SOLUTION: The semiconductor device includes: electrodes 8 formed on a semiconductor chip 2; and spherically shaped low melting point metal balls 3 of predetermined sizes which are adhesives bonded to these electrodes with flux. The method for flip-chip bonding uses the electrodes and the balls. COPYRIGHT: (C)2005,JPO&NCIPI |
