发明名称 SEPARATION METHOD AND SEPARATION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method capable of exactly separating a mixture of product after plating treatment and a dummy used at the plating treatment to the respective parts and preventing a bonding dummy from being mixed to the product even when the bonding dummy is contained in the mixture. SOLUTION: Of the mixture of the product C fed onto a first separation plate 11, the dummy D1 and the bonding dummy D2, the product C forming a prism and the bonding dummy D2 are moved so as to ascend the first separation plate 11 and are dropped off on a second separation plate 12. The dummy D1 forming a spherical shape is moved so as to descend on the first separation plate 11 and is dropped off on a fourth separation plate 14. Subsequently, the product C dropped off on the second separation plate 12 is moved so as to ascend the second separation plate 12 and is dropped off from a rear end of the second separation plate 12. The bonding dummy D2 dropped off on the second separation plate 12 is moved so as to descend on the second separation plate 12 having an inclination angleθ12 larger than the inclination angleθ11 of the first separation plate 11 and is dropped off on a third separation plate 13. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005021758(A) 申请公布日期 2005.01.27
申请号 JP20030187766 申请日期 2003.06.30
申请人 TAIYO KAGAKU KOGYO KK 发明人 YOSHIKAWA TAKEFUMI;KAWABATA YOHEI;YOSHIDA KAZUYUKI;YAMAMOTO TOSHIYUKI
分类号 B07B13/11;(IPC1-7):B07B13/11 主分类号 B07B13/11
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