发明名称 COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a compact cooling system that can surely prevent the temperature rise of a semiconductor element which generates high-temperature heat. SOLUTION: The cooling system absorbs the heat generated from the semiconductor element by means of latent heat by vaporizing a refrigerant in a cooler set up in contact with the element, liquefies the vaporized refrigerant in a condenser, and circulates the obtained liquid by means of a liquid pump. The cooling system is reduced in cost by adopting a perforated flat pipe as the cooler, and, at the same time, is constituted to prevent gas suction operation by providing a liquid sump in front of the liquid pump and to cope with the change of the required amount of the refrigerant caused by the variation of external conditions by providing containers in two phase regions. Consequently, the cooling system can be operated stably and efficiently by setting the supercooling temperature at the outlet of the condenser to 1-6°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026259(A) 申请公布日期 2005.01.27
申请号 JP20030186821 申请日期 2003.06.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IKEDA AKIRA;NAKANO MASAO;ASHITANI HIROMASA
分类号 F25D17/02;F25D9/00;F28D15/02;F28F1/02;H01L23/427;(IPC1-7):H01L23/427 主分类号 F25D17/02
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