| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor laser equipment of structure in which heat dissipation is especially good, thermal resistance is small and a thermoelectric cooling element for cooling the semiconductor laser element is not necessary. SOLUTION: In the semiconductor laser equipment, a plurality of bonding wires 26 connecting the semiconductor laser element 22 with one side lead 11b and bonding wires 27 which connects a submount 23 of the laser element 22 with a header 14 are arranged and constituted. As a result, a current value per bonding wire is reduced, the thermal resistance falls off, and heat dissipation is improved, so that temperature rise of the laser element 22 is restrained and a long life of the laser element 22 can be obtained. Since the temperature of a light receiving element 17 also seldom needs to go up, its light receiving property (monitor current value) is stabilized, and accurate output control is enabled. Further, high frequency superposition for multimoded becomes easy to be applied. COPYRIGHT: (C)2005,JPO&NCIPI
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