| 摘要 |
PROBLEM TO BE SOLVED: To obtain a solid-state imaging unit which has improved operation stability by increasing the noise resistance of an EMC by a simple constitution. SOLUTION: Power source wiring 11 and 12 connected to a power source pad of a solid-state imaging device 1 and power source wiring 13 and 14 connected to a power source pad of an integrated circuit chip are arranged in parallel at extremely close intervals, the power source wiring 11 to 14 are placed with fixed widths, bent parts are smoothly curved at curvatures that are not higher than a prescribed curvature to be formed on a flexible wiring board 3, and power source pads of a high potential side and a low potential side of the solid-state imaging device 1 or of the integrated circuit chip 2 are made adjacent to each other. COPYRIGHT: (C)2005,JPO&NCIPI
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