| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problems that the number of layers in a mother board is increased and an interval between modules is widened with a coupling wiring length and mounting is performed with high density in a multi-module system, concerning a conventional memory system incorporating a directional coupler in the mother board. SOLUTION: A directional coupler part is individually made into a component through the use of a high dielectric material and the component is mounted on the mother board. Specifically, a coupler is provided, having a feature in one of the following couplers, i.e., a four-terminal type coupler (terminating resistor is needed), a three-terminal type coupler (no terminating resistor and half signal amplitude), a near-end loop three-terminal type coupler (no terminating resistor, no change in signal amplitude), and far-end loop three-terminal type coupler (no terminating resistor, half coupler size, half signal amplitude). Then a memory module is mounted with high density in a directional coupling bus system. COPYRIGHT: (C)2005,JPO&NCIPI
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