| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for light emitting device that is constituted to prevent the deterioration of bondability caused by electric erosion or oxidation and the occurrence of migration and, at the same time, to have excellent reflecting characteristics to LED chips having different light emitting wavelengths from red light to blue light so that the substrate may be used commonly for the LED chips; and to provide a light emitting device. <P>SOLUTION: The light emitting device 1 is formed of an insulating substrate 2, an LED chip 3 mounted on the surface of the substrate 2, a light-transmissive resin 4 which seals the chip 3 by covering the whole surface of the substrate 2, and so on. On the surfaces of surface-side conductive patterns 5 and 6 provided on the surface of the substrate 2, a connecting region 11 in which the chip 3 is mounted and another connecting region 12 to which one end of a bonding wire 13 is connected are respectively formed in a state where plated gold layers 9 are exposed, and undercoat layers 17 are respectively formed on the other areas of the surfaces. In addition, vapor-deposited reflecting film layers 18 are formed on the surfaces of the undercoat layers 17 by vapor-depositing one metal selected from among Al, Rh, Zn, and Ni. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
