MULTILAYER-TYPE WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a highly reliable and compact multilayer-type wiring board with high manufacturing yield. SOLUTION: The method for manufacturing the multilayer-type wiring board comprises the steps of forming conductive bump groups 12 on the predetermined surface of a position of a wiring pattern layer 50 of the wiring material having the wiring pattern layer 50 and a conductive foil 21 connected by projecting conductors 11 and 13 pressure inserted through the thermoplastic resin series interlayer insulating layer 31, sequentially laminate arranging the thermoplastic resin series insulating layer 33 with its laminated surface roughened and a conductive foil 25 on the formed conductive bump groups 12, and making a both side copper foil laminated material plate 90 by heat pressurizing these and penetrating a tip of the bump groups 12 through a thermoplastic resin series insulator layer 33 so as to butt against the conductive foil 25 and to be deformed. COPYRIGHT: (C)2005,JPO&NCIPI